Capabilities

 

 

 

Item

Capability

Remarks

Finish product

Max layer count

20 layers

1-20 layers

Surface treatment

 

HASL, HASL lead free, ENIG, Immersion Ag, Immersion Tin, OSP, Golden finger, Gold plating, Selective ENIG,ENEPIG

Thickness

0.4--3.5mm (Rigid board)

0.06~0.4mm (Flexible board)

Regular PCB thickness we produce: 0.4/0.6/0.8/1.0/1.2/1.6/2.0 mm, max 3.5mm for rigid board

Tolerance (T≥1.0mm)

± 10%

e.g. T=1.6mm, Final thickness is 1.44mm(T-1.6×10%)~1.76mm(T+1.6×10%)

Tolerance (T<1.0mm)

±0.1mm

e.g. T=0.8mm, Final thickness is 0.7mm(T-0.1)~0.9mm(T+0.1)

Laminate type

 

FR4, CEM1, CEM3, MCPCB, FPCB

Circuit design

Min track and spacing

≥3/3mil(0.076mm)

4/4mil( copper 1 oz),5/5mil(copper 2 oz),8/8mil(copper 3 oz)

 

Min network track and spacing

≥6mil/8mil(0.15/0.20mm)

6/8mil(copper 1 oz),8/10mil(copper 2 oz ),10/12mil(copper 3 oz)

 

Min etching legend

≥8mil(0.20mm)

8mil(copper 1 OZ),10mil(copper 2 OZ),12mil(copper 3 OZ)

 

Min BGA,Bolding pad

≥6mil(0.15mm)

   

Outer layer copper

35--175um

   

Inner layer copper

17-70um

   

Spacing between track and outline

≥10mil(0.25mm)

CNC routing type not less than 0.25mm;V groove type not less than0.35mm

 

Copper bridge

4mil

   

Drilling

Min diameter of half hole process

0.5mm

Half-hole is a special process, the diameter should be not less than 0.5mm

 

Min hole(drilling machine)

0.2mm

Min 0.2mm, tolerance ±0.075mm

 

Min slot(drilling machine)

0.6mm

Tolerance±0.1mm

 

Min hole(Laser)

0.1mm

Tolerance ±0.01mm

 

Min hole

≥0.2mm

Diameter ≥0.2mm,Spacing ≥0.25mm

 

Stamp holes

0.5mm

Min diameter 0.25mm, min quantity ≥3pcs

 

Plug holes

≤0.6mm

Cover oil

 

Via holes

4mil

Via holes min 4mil, component holes min 6mil

 

Solermask

Type

LPI

White, black, blue, green, yellow, red

 

Solarmask bridge

Green≥0.1mm

Others≥0.12mm

White/black≥0.15mm

Spacing between pads should be larger than 0.18mm, the heavier copper is, the larger spacing should be.

 

Legend

Min width

≥0.6mm

   

Min height

≥0.8mm

   

Min line width

≥0.1mm

   

Spacing between solarmask and SMT square

≥0.2mm

   

Ratio of width and height

1:0.5

   

Profile

Min slot knife

0.60mm

   

Max delivery size

550mm x 560mm (multi-layer)

1500mm x 550mm (single/double layer)

   

V-CUT

V-CUT Length ≥55mm

V-CUT Width ≤380mm

1.V-CUT length refer to V-CUT start to end

2.V-CUT width refer V-CUT vertical single pcb width

 

Panel array

Min spacing for Vcut

0mm

Common pcb panel

 

Min spacing for CNC routing

1.6mm

   

Half-hole pcbs

 

1. Single or double layer pcb uses Vcut or stamp holes

2. 3 or 4 layers pcbs use connection bridge on 4 angles

 

Process

Peel strength

≥2.0N/cm

   

Flamability

94V-0

   

Impedance type

 

Single ended controllable:45~85ohm , differential impedance:85~110 ohm

 

Special process

 

resin plug-hole, Holes in pad, mixed board laminate, PTFE, Blind & buried holes, Bolding IC

 
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