Capabilities
Item |
Capability |
Remarks |
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Finish product |
Max layer count |
20 layers |
1-20 layers |
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Surface treatment |
HASL, HASL lead free, ENIG, Immersion Ag, Immersion Tin, OSP, Golden finger, Gold plating, Selective ENIG,ENEPIG |
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Thickness |
0.4--3.5mm (Rigid board) 0.06~0.4mm (Flexible board) |
Regular PCB thickness we produce: 0.4/0.6/0.8/1.0/1.2/1.6/2.0 mm, max 3.5mm for rigid board |
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Tolerance (T≥1.0mm) |
± 10% |
e.g. T=1.6mm, Final thickness is 1.44mm(T-1.6×10%)~1.76mm(T+1.6×10%) |
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Tolerance (T<1.0mm) |
±0.1mm |
e.g. T=0.8mm, Final thickness is 0.7mm(T-0.1)~0.9mm(T+0.1) |
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Laminate type |
FR4, CEM1, CEM3, MCPCB, FPCB |
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Circuit design |
Min track and spacing |
≥3/3mil(0.076mm) |
4/4mil( copper 1 oz),5/5mil(copper 2 oz),8/8mil(copper 3 oz) |
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Min network track and spacing |
≥6mil/8mil(0.15/0.20mm) |
6/8mil(copper 1 oz),8/10mil(copper 2 oz ),10/12mil(copper 3 oz) |
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Min etching legend |
≥8mil(0.20mm) |
8mil(copper 1 OZ),10mil(copper 2 OZ),12mil(copper 3 OZ) |
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Min BGA,Bolding pad |
≥6mil(0.15mm) |
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Outer layer copper |
35--175um |
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Inner layer copper |
17-70um |
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Spacing between track and outline |
≥10mil(0.25mm) |
CNC routing type not less than 0.25mm;V groove type not less than0.35mm |
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Copper bridge |
4mil |
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Drilling |
Min diameter of half hole process |
0.5mm |
Half-hole is a special process, the diameter should be not less than 0.5mm |
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Min hole(drilling machine) |
0.2mm |
Min 0.2mm, tolerance ±0.075mm |
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Min slot(drilling machine) |
0.6mm |
Tolerance±0.1mm |
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Min hole(Laser) |
0.1mm |
Tolerance ±0.01mm |
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Min hole |
≥0.2mm |
Diameter ≥0.2mm,Spacing ≥0.25mm |
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Stamp holes |
0.5mm |
Min diameter 0.25mm, min quantity ≥3pcs |
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Plug holes |
≤0.6mm |
Cover oil |
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Via holes |
4mil |
Via holes min 4mil, component holes min 6mil |
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Solermask |
Type |
LPI |
White, black, blue, green, yellow, red |
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Solarmask bridge |
Green≥0.1mm Others≥0.12mm White/black≥0.15mm |
Spacing between pads should be larger than 0.18mm, the heavier copper is, the larger spacing should be. |
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Legend |
Min width |
≥0.6mm |
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Min height |
≥0.8mm |
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Min line width |
≥0.1mm |
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Spacing between solarmask and SMT square |
≥0.2mm |
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Ratio of width and height |
1:0.5 |
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Profile |
Min slot knife |
0.60mm |
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Max delivery size |
550mm x 560mm (multi-layer) 1500mm x 550mm (single/double layer) |
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V-CUT |
V-CUT Length ≥55mm V-CUT Width ≤380mm |
1.V-CUT length refer to V-CUT start to end 2.V-CUT width refer V-CUT vertical single pcb width |
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Panel array |
Min spacing for Vcut |
0mm |
Common pcb panel |
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Min spacing for CNC routing |
1.6mm |
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Half-hole pcbs |
1. Single or double layer pcb uses Vcut or stamp holes 2. 3 or 4 layers pcbs use connection bridge on 4 angles |
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Process |
Peel strength |
≥2.0N/cm |
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Flamability |
94V-0 |
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Impedance type |
Single ended controllable:45~85ohm , differential impedance:85~110 ohm |
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Special process |
resin plug-hole, Holes in pad, mixed board laminate, PTFE, Blind & buried holes, Bolding IC |